core drill bits In the wafer processing process

In the wafer processing process, particularly a fast grinding or polishing, core drill bits  and thermal deformation due to wear of the grinding disc, and the flatness of the wafer is difficult to ensure parallelism. Silicon carbide ceramic grinding disc high hardness and wear due to the small grinding disc, and the thermal expansion coefficient of silicon is basically the same and thus  Abrasive grinding wheels  can speed grinding, polishing. Especially in recent years the wafer size increases, the quality and efficiency of the silicon wafer grinding higher requirements. The use of silicon carbide ceramic grinding plate will make the quality and efficiency of silicon grinding has greatly improved. Meanwhile silicon carbide ceramic grinding disc can be used for grinding, polishing flat sheet or block other material objects.